Low profile 90° FIB pin mount with short pin (6mm) for ZEISS/LEO systems Unit:pkg/10 Wafer Thickness: 655-695 µm

Wafer Thickness: 655-695 µm

The PELCO Low Profile SEMClip™ Specimen Mounts have been designed for high tilt and short working distance imaging applications

MRS-6NT Reference Standard

15nm with 2 each 0

5441 Aesculap® Microscopy Forceps

Low profile 90° FIB pin mount with short pin (6mm) for ZEISS/LEO systems Unit:pkg/10 Wafer Thickness: 655-695 µmDESCRIPTION These special low profile pin mounts are available as flat, as a 90 mount, and with specific angles ideally suited to accommodate specimens with small working distances in FIB, DualBeam and CrossBeam systems. Made out of aluminum. Fully compatible with standard pin stub mounts (pin 3. 2mm diameter) for sample storage and transport. These mounts can be used directly in FEI and TESCAN systems with the standard pin length and ZEISS LEO